Application fields:
Metal plating thickness and content analysis (electroplating industry, precious metal industry, PCB industry etc.)
Features:
Excellent sample observation system; Advanced image identification;
Easy detection of sample with deep groove;
Four micro-focus collimators allowing automatic switch;
Double safeguard procedures to realize seamless anticollision; Large area high resolution detector, effectively reducing detection limit and improving test accuracy;
Automatic intelligent control mode, one-click operation;
Automatic self-check and reset when starting up.